BAS40?06LT1G, SBAS40?06LT1G
http://onsemi.com
3
PACKAGE DIMENSIONS
SOT?23 (TO?236)
CASE 318?08
ISSUE AP
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SCALE 10:1
mm
inches
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT
VIEW C
L
0.25
L1
e
E
HE
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1
0.01 0.06 0.10 0.001
b
0.37 0.44 0.50 0.015
c
0.09 0.13 0.18 0.003
D
2.80 2.90 3.04 0.110
E
1.20 1.30 1.40 0.047
e
1.78 1.90 2.04 0.070
L
0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
2.10 2.40 2.64 0.083
0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.029
c
0?
???
10 0?
?
???
10?
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
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